JPH019157Y2 - - Google Patents
Info
- Publication number
- JPH019157Y2 JPH019157Y2 JP8507582U JP8507582U JPH019157Y2 JP H019157 Y2 JPH019157 Y2 JP H019157Y2 JP 8507582 U JP8507582 U JP 8507582U JP 8507582 U JP8507582 U JP 8507582U JP H019157 Y2 JPH019157 Y2 JP H019157Y2
- Authority
- JP
- Japan
- Prior art keywords
- spool
- container
- lid
- height
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 229910001111 Fine metal Inorganic materials 0.000 claims description 7
- 239000007779 soft material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8507582U JPS58187142U (ja) | 1982-06-08 | 1982-06-08 | スプ−ルケ−ス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8507582U JPS58187142U (ja) | 1982-06-08 | 1982-06-08 | スプ−ルケ−ス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58187142U JPS58187142U (ja) | 1983-12-12 |
| JPH019157Y2 true JPH019157Y2 (en]) | 1989-03-13 |
Family
ID=30093988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8507582U Granted JPS58187142U (ja) | 1982-06-08 | 1982-06-08 | スプ−ルケ−ス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187142U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0512207Y2 (en]) * | 1987-11-24 | 1993-03-29 |
-
1982
- 1982-06-08 JP JP8507582U patent/JPS58187142U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58187142U (ja) | 1983-12-12 |
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